KUALA LUMPUR - Malaysia is targeting at least 500 billion ringgit in investments for integrated circuit design, advanced packaging and manufacturing equipment for semiconductor chips, Prime Minister Anwar Ibrahim said on Tuesday.
Malaysia wants to establish at least 10 local companies in design and advanced packaging for semiconductor chips, with revenues between $210 million to $1 billion, Anwar said in a speech at an industry event.The Southeast Asian country will allocate $5.3 billion in fiscal support to meet these targets, Anwar said at the event in Kuala Lumpur.It has been our privilege to have the trust and support of our East Coast communities for the last 200 years.
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